Co-package technology platform for low-power and low-cost data centers
June 2021 - UCL joins industrial companies and other universities across Europe to work on co-package technology platform for low-power and low-cost data centers.
Universities and industry across Europe work on co-package technology platform for low-power and low-cost data centers. The inter-institution research team reports the recent advances introduced by the European research project L3MATRIX in silicon photonics and in photonic-electronic integration. The advances in the areas of system architecture and design, light sources, fabrication of individual silicon photonics components and conventional and slow-light modulators provide a toolbox of technologies and architectures to address related challenges.
The research team has developed their strategy for a full 3D vertical assembly approach and their proposed system architecture. The results provide a step toward future low-power and low-cost data centers.
The findings were published in June 2021 in Applied Sciences -
- Papatryfonos K, Selviah D, Maman A, Hasharoni K, Brimont A, Zanzi A, Kraft J, Sidorov V, Seifried M, Baumgartner Y, Horst F, Offrein B, Lawniczuk K, Broeke R, Terzenidis N, Mourgias-Alexandris G, Tang M, Seeds A, Liu H, Sanchis P, Moralis-Pegios M, Manolis T, Pleros N, Vyrsokinos K, Sirbu B, Eichhammer Y, Oppermann H and Tekin T (2021). "Co-package technology platform for low-power and low-cost data centers", Applied Sciences 11.13 (2021): 6098. DOI: 10.3390/app11136098